Mbali Zamkuwa Zopindika ndi Zobowoledwa Mwamakonda - Zopangidwa Mogwirizana ndi Zomwe Mumasankha

Zigawo zamkuwa zolondola kwambiri

Timapanga zinthu zomalizidwa bwino kwambiri kuchokera ku mkuwa wa C11000/C10100 (Cu ≥ 99.99%), zomwe zimathandiza makasitomala akuluakulu mu mphamvu zatsopano, kulumikizana ndi magetsi, kasamalidwe ka kutentha, zolumikizira za RF coaxial, ndi zida zamafakitale zapamwamba.

Njira Zofunikira Zopangira

● Zipangizo zopangira: High-purity electrolytic tough pitch (ETP) kapena ingots zamkuwa zopanda mpweya (Cu ≥ 99.99%)
● Kusungunula: Ng'anjo yotulutsira mpweya yapakatikati pansi pa vacuum kapena mlengalenga woteteza kuti muchepetse mpweya
● Njira zopangira: Kutentha/kutsogolo kozizira → Kutulutsa kozizira kwa malo ambiri → Kukonza kozungulira kwa CNC koyenera → Kuchotsa zotsalira + kuyeretsa kwa ultrasound
● Kumaliza pamwamba: Kuphimba kowala, kusankha kapena electroplating yonse (Ag, Au, Sn, Ni) mogwirizana ndi miyezo ya IPC-4552/4553
● Kulondola kwa miyeso: Kulekerera kwachizolowezi ± 0.01 mm; zinthu zofunika kwambiri zomwe zingatheke kufika ± 0.005 mm (zodalira mbali)

Dongosolo Lowongolera Ubwino

● Yogwiritsidwa ntchito motsatira dongosolo lonse la IATF 16949 loyang'anira khalidwe
● Zinthu zomwe zikubwera: Kusanthula kwa 100% kwa spectrometer yowerengera mwachindunji + kuphulika kwa haidrojeni ndi kuyesa kuchuluka kwa okosijeni
● Kuyang'anira kotuluka: Kuyendetsa magetsi (IACS%), makulidwe a plating (X-Ray), kumatira (kupindika/kutentha), kugwira ntchito kwa salt-spray, lipoti lathunthu, ndi Chiphaso cha Zinthu 3.1 chokhala ndi kutsata kwathunthu kwa batch ya ingot.
● Kugwira ntchito bwino kwa chilema: DPPM < 50 pa ma batches a maakaunti ofunikira

Timayang'ana kwambiri kupereka deta yobwerezabwereza yofanana ndi yofanana komanso deta yolondola m'malo molemba mawu otsatsa. Mwalandiridwa kutumiza zojambula kapena zitsanzo zenizeni; nthawi zambiri timamaliza kuwunikanso njira ndikupereka lipoti la DFM ndi mtengo wovomerezeka mkati mwa masiku atatu mpaka asanu ogwira ntchito.